
| Physical parameter | 01a. SMT chip (SBA 2512) | 01b. High-Power (SBA 2550) | 02. High-Current (SBB 5930) | 03. 4-wire Kelvin (SBC 4026) | 04. Open Frame (SBD 4512/4524) | 05. Busbar (EB-Welding) | 06. Custom Punching and Bending |
|---|---|---|---|---|---|---|---|
| Rated Resistance (R) | 0.2 mΩ - 10 mΩ | 0.045 mΩ - 0.50 mΩ | 0.1 mΩ - 3.0 mΩ | 0.2 mΩ - 5.0 mΩ | 1 mΩ - 50 mΩ | project-specific | project-specific |
| Rated Power (P70) | 1.5 W - 6.0 W | up to 12 W | 5.0 W - 15.0 W | 3.0 W - 12.0 W | 2.0 W - 5.0 W | as interpreted | application-specific |
| Continuous Current (Imax) | as specified in the data sheet | as specified in the data sheet | as specified in the data sheet | as specified in the data sheet | as specified in the data sheet | project-specific | as interpreted |
| Temperature Coefficient (TCR) | According to the standard data sheet / depending on material and type | According to the standard data sheet / depending on material and type | According to the standard data sheet / depending on material and type | According to the standard data sheet / depending on material and type | According to the standard data sheet / depending on material and type | According to the standard data sheet / depending on material and type | According to the standard data sheet / depending on material and type |
| Thermal Power vs. Copper | Low; depends on the alloy and type, as specified in the data sheet | Low; depends on the alloy and type, as specified in the data sheet | Low; depends on the alloy and type, as specified in the data sheet | Low; depends on the alloy and type, as specified in the data sheet | Low; depends on the alloy and type, as specified in the data sheet | Low; depends on the alloy and type, as specified in the data sheet | Low; depends on the alloy and type, as specified in the data sheet |
| Tolerance Classes | depending on the series and resistance value | 1 %, 2 %, 5 % | 1 %, 5 % | 1 %, 2 %, 5 % | 1 %, 3 %, 5 % | project-specific | project-specific |
| Self-inductance (L) | low-induction | low-induction | low-induction | reduced (4-wire) | low-induction | geometry-dependent | geometry-dependent |
| Joining Processes / Materials | Manganin/Aluchrom | Manganin/Aluchrom | Cu-Mn / NiCr | Manganin / OF-Cu | electron beam | Vacuum EB Welding | Stamping and Bending / Manganin |
| Distinctive Feature | Flat-pack chip design | Advanced Features | Solid copper block | Separate voltage tap | Decoupled Geometry | Monolithic Rail | Direct Mounting of Relays/Electric Meters |
| Main Application | Electronics / Assemblies | Power Electronics | Drive Inverter / EV | Measurement Systems / Meters | Case without a fan | BMS / Traction Battery | Latching Relay / e-Meter |
| Standards / QMS | IATF 16949 (QMS) | IATF 16949 (QMS) | IATF 16949 (QMS) | IATF 16949 (QMS) | IATF 16949 (QMS) | IATF 16949 (QMS) | ISO 9001 (QMS) |
| Rated Resistance Range | project-specific (e.g., sub-milliohm) |
| Continuous Current Rating | Designed specifically for each project according to requirements |
| Joining Process for Contact Rails | Vacuum EB Welding |
| Material Combination | OF-CU / Manganin / Aluchrom |
| Mechanical Connection | Screw connection or welded connection according to the CAD drawing |
| Tolerances & TCR | in accordance with the project specification and data sheet |
| Compliance with Standards | Project-Based Qualification Exams |
| Rated Resistance Range | 0.2 mΩ to 10.0 mΩ |
| Rated Power (P70) | 1.5 W to 6.0 W (depending on the size) |
| Resistance Tolerance Classes | depending on the series and resistance value |
| Temperature Coefficient (TCR) | as specified in the product data sheet |
| Thermal Stress on Copper | < 1 µV/K |
| Operating temperature range | -55 °C to +170 °C |
| Housing Design | SMD / SMT 2512 |
| Resistance material | Cu-Mn-Sn / Cu-Mn / Aluchrom / NiCr (depending on the variant) |
| Manufacturing Standard | Manufacturer QMS: IATF 16949 / ISO 9001 |
| Rated Resistance Range | 0.1 mΩ to 1.0 mΩ |
| Rated Power (P70) | up to 12 W in the standard portfolio |
| Resistance Tolerance Classes | 1 %, 2 %, 5 % |
| Temperature Coefficient (TCR) | as specified in the product data sheet |
| Thermal Stress on Copper | < 1 µV/K |
| Housing Design | SMD / SMT 2550 |
| Resistance material | Manganin / Aluchrom |
| Manufacturing Standard | Manufacturer-certified to IATF 16949 / ISO 9001 |
| Rated Resistance Range | 0.1 mΩ to 3.0 mΩ |
| Rated Power (P70) | 5.0 W to 15.0 W |
| Resistance Tolerance Classes | 1 %, 5 % |
| Temperature Coefficient (TCR) | as specified in the product data sheet |
| Housing Design | SMD / SMT 5930 |
| Resistance material | Cu-Mn-Sn / Cu-Mn / NiCr / Aluchrom (depending on the variant) |
| Limit Values / Pulse Load | according to the verified manufacturer's specification sheet |
| Manufacturing Certification | IATF 16949 Quality Management System |
| Manufacturing Standard | SMD 4026 |
| Rated Resistance Range | 0.2 mΩ to 5.0 mΩ |
| Rated Power (P70) | 3.0 W to 12.0 W |
| Resistance Tolerance Classes | 4-wire (Kelvin method) |
| Temperature Coefficient (TCR) | 1%, 2%, 5% |
| Housing Design | as specified in the product data sheet |
| Connection Topology | Manufacturer-certified to IATF 16949 / ISO 9001 |
| Rated Resistance Range | 1,0 - 50,0 mΩ |
| Rated Power (P70) | 2.0 W to 5.0 W |
| Connection Topology | 4-wire (Kelvin method) |
| Resistance Tolerance Classes | 1 %, 3 %, 5 % |
| Temperature Coefficient (TCR) | Depending on size and type, as specified in the standard data sheet |
| Housing Design | Depending on size and type, as specified in the standard data sheet |
| Manufacturing Standard | Depending on size and type, as specified in the standard data sheet |


| Parameter / Physical parameter | Specified Service Area (ROTIMA Portfolio) |
|---|---|
| Rated Resistance Range (R) | Starting at 0.025 mΩ; custom values available on a project-by-project basis |
| Rated Power (P70) | 1.5 W to 15.0 W (standard SMD portfolio); higher power ratings available on a project-by-project basis |
| Temperature Coefficient (TCR) | Low TCR values depending on the material and series, as specified in the data sheet |
| Thermal Voltage vs. Copper (Thermal EMF) | Low thermal stresses depending on the resistance alloy |
| Resistance Tolerance Classes | Depends on the series and resistance value, as specified in the standard data sheet; the standard portfolio includes, among others, 1%, 2%, 3%, 4%, 5%, and 10% |
| Parasitic self-inductance (L) | Low-inductance geometries for high-frequency switching operations |
| Operating temperature range | -55 °C to +170 °C (according to the series specification) |

