Heat generation is a critical factor in off-board shunt resistors, as high currents can lead to
considerable self-heating. Without effective heat dissipation, this can lead to
measurement inaccuracies, resistance drift and premature material fatigue. Off-board
shunts are therefore designed to
enable optimum heat dissipation, for example through larger designs, special housings or direct mounting on heat sinks.
A crucial aspect of temperature management is the selection of a resistor material with a
low temperature coefficient of resistance (TCR). Materials such as
manganin or nichrome have a naturally
low change in resistance with temperature fluctuations, which leads to greater
long-term stability. In addition, heat dissipation can be further improved by a targeted
layout design and the placement of the shunt in a
well-ventilated or cooled location.
Some off-board shunt
resistors are also equipped with special
cooling technologies such as metal cooling plates or integrated heat spreaders to reduce the thermal load. In applications with
very high currents, the combination of a
low resistance value, an optimized design and additional cooling measures can be crucial to
ensure consistently precise current measurement and a long service life of the component.